Principle

The principle is simple
A thin wire of typically 140µm or 160µm is wrapped around a set of wire-guides creating a wire web. The rotation of the wire-guides drives the wire web that is carrying an abrasive liquid. As the ingot is pushed down through the wire web, it is sliced into thin wafers.

The execution is challenging
Mechanical linearity, thermal stability and process consistency achieve precision. High uptime, minimal maintenance, low-cost consumables and high capacity achieve cost effectiveness.

The result benefits an entire industry
Applid HCT wire-saws are chosen as state of the art machines by leading suppliers to both, the semiconductor and photovoltaic industries.
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