Publications

Since the release by HCT of the very first industrial wire saw in 1983, HCT is continuously improving the wire sawing technology by investing and committing to fundamental developments in addition to continuous innovation in engineering.

HCT scientists are active members of public research projects and regularly participate with industry leaders producing technical papers.

Recent Advance in Wire Wafering Technology
Hauser, C., Proc. 7th European Photovoltaic Solar Energy Conference, Sevilla, Spain, 1986.

Latest Results and expected Possibilities of Wire Wafering Technology
Hauser, C., Proc. 9th European Photovoltaic Solar Energy Conference, Freiburg, Germany, 1989.

High Speed slicing with Ultrasonic assisted Wire Saw
Hauser, C., Proc. 11th European Photovoltaic Solar Energy Conference, Montreux, Switzreland, 12-16 October, pp. 1061-1062, 1992.

Advanced Slicing Techniques for Single Crystals
Hauser, C., and Nasch P.M., Proceedings of the First International School on Crystal Growth Technology (ISCGT-1), Beatenberg, Switzerland, September 5-16, 1998, pp. 204-216.

Advanced Slicing Techniques for Single Crystals
Hauser, C, and Nasch P.M., in Crystal Growth Technology, Eds. H. J. Scheel and T. Fukuda, (Wiley), pp. 531-559, 2003.

Slicing Technology and Thin Wafer
Hauser, C., and Nasch P.M., Workshop « Dependable and Economic Silicon Materials Supply for Solar Cell Production », December 7-12, 1998, JRC-Ispra, Italy.

Waste Processing in Wafer Slicing Techniques Used as Economical Factor
Hauser, C., and Nasch P.M., Proc. SEMICON China 1999 – Technical Symposium, China World Hotel, Beijing, China, pp. K1-K7 of Technical Program, March 17-18, 1999.

Waste Control in Wafer Slicing Techniques
Nasch P.M. and C. Hauser, Proc. 16th European Photovoltaic Solar Energy Conference and Exhibition , Glasgow, UK, 1-5 May 2000.

The Challenge to Implement Thin Wafer Potential with Wire Saw Cutting Technology
Mueller, A., N. Cherradi and P. M. Nasch, 3rd World Conference on Photovoltaic Energy Conversion (WCPEC-3), Osaka, Japan, May 11-18, 2003.

The Latest Achievements on Wire-saw Cutting Technology for Large Wafer Applications
Mueller, A., ISPM-300mm Si, Beijing, Sept. 8-9, 2003.

The way to high-efficiency, low cost solar cells through Thin Wafer Slicing by Means of Wire Saw
Nasch P.M., N. Cherradi, A., Mueller, C. Seifert, B.Geyer, Proc. 19th Euro pean Photovoltaic Solar Energy Conference and Exhibition, Paris, France, 7-11 June, 2004.

Theoretical Modelling of Consumables Usage as a Tool for Cost Reduction in Silicon Wafering Using Multi-Wire Slurry Saw
Nasch, P. M., and S. Schneeberger, Proc. 20th European Photovoltaic Solar Energy Conference and Exhibition , Barcelona, Spain, 6-10 June 2005.

New Silicon-Saving Technology for Post-Growth Brick Shaping
Nasch, P. M., Van Der Meer M., Schneeberger S., Proc. 21st European Photovoltaic Solar Energy Conference and Exhibition , Dresden, Germany, 4-8 September, 2006.

Towards Production mean of 1000 Wafers per hour with CMWS
Hauser, C.,Factory publication, 1991

    Order Publications